TECHNET Archives

May 2013

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Inge Hernefjord <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Inge Hernefjord <[log in to unmask]>
Date:
Sun, 26 May 2013 13:26:46 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines)
Hi Ramakrishnan,

1. Solder dip test tells about  the WETTABILITY.

2. Floating test tells about the ALIGNMENT

Typically 1. is performed on just a few coupons and NO components, while 2.
is done with many coupons (or PCBs) and WITH  components. For getting good
statistics it's not unusual with 10,000 components.

Inge


On 25 May 2013 14:02, Ramakrishnan Saravanan <[log in to unmask]> wrote:

> What is the difference between solder dip test and solder float test of
> PWB test coupon. What is the difference in stress levels ?
>
> regards,
>
> R.Saravanan
>


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2