TECHNET Archives

May 2013

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Glidden, Kevin" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Glidden, Kevin
Date:
Tue, 21 May 2013 16:39:03 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines)
Hi all,

It looks like I will be getting some PCBs with OSP finish on them to process thru SMT.  I've not yet used this surface finish, so for me there are a lot of unknowns.
Some background info:
1 The PCBs will be single sided SMT, so I will not have to worry about solderability of second side reflow.
2 We are using Sn63Pb37, not lead-free.
3 We are using water soluble ORM0 paste and DI water wash only (no chemical)
4 We typically process with ImAg.
5 MIL/AERO target service environment

I have read some that shelf life is reduced to around 6 months and that OSP covered pads cannot be used as test points and therefore test pads need to be solder coated.  I've also read some of the conference papers which seem to indicate corrosion/environmental performance is at least as good as what we would get with ImAg.

Any other suggestions / caveats ?

Is there an IPC spec for this finish?

Thanks in advance!

Kevin


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2