TGASIA Archives

May 2013

TGAsia@IPC.ORG

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From:
Tang Xianjun <[log in to unmask]>
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Date:
Thu, 9 May 2013 05:22:57 +0000
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個人認為要調整爐溫和增加錫膏,不知道是否有治具一起過迴流焊的?

Best Regards

-----原始郵件-----
寄件者: TGAsia [mailto:[log in to unmask]] 代理 Jeff Chen
寄件日期: 2013年5月9日星期四 12:20
收件者: [log in to unmask]
主旨: [TGAsia] Soldering bubble problem root


Dear All,

One of my customer feedback the bubble problem when soldering. The defective sample is as the following cross section chart.

Would you pls kindly help to analysis the root reason of  this problem?
Usually which situation will cause the soldering bubble problem?

Thanks very much for your time and your effort.

Best regards.
Jeff Chen


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