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May 2013

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Subject:
From:
"Gumpert, Ben" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gumpert, Ben
Date:
Thu, 9 May 2013 12:34:26 +0000
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Bob,

We were just having a discussion on double tinning.

A dynamic solder wave means a source of solder that is flowing, like a flowing solder pot. If the pot is static (just a pool of molten solder), then you need to dip the item twice to ensure adequate gold removal. If you are tinning by hand using solder and an iron, then you need to tin and wick then repeat.

Ben 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert DeQuattro
Sent: Thursday, May 09, 2013 8:28 AM
To: [log in to unmask]
Subject: EXTERNAL: [TN] Gold Removal

Hello Fellow Technetter's,

I have a question on J-Std-001E 4.5.1 Gold removal which states a double tinning process  or dynamic solder wave may be used.  Can any of you describe this process.  How is the gold actually removed?  Or is it just being tinned?  Gold melts at over 1000 C so I am a little confused.

Thanks,

Bob

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