Hello Fellow Technetter's,
I have a question on J-Std-001E 4.5.1 Gold removal which states a double tinning process or dynamic solder wave may be used. Can any of you describe this process. How is the gold actually removed? Or is it just being tinned? Gold melts at over 1000 C so I am a little confused.
Thanks,
Bob
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________