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May 2013

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Subject:
From:
Robert DeQuattro <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Robert DeQuattro <[log in to unmask]>
Date:
Thu, 9 May 2013 12:27:31 +0000
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Hello Fellow Technetter's,

I have a question on J-Std-001E 4.5.1 Gold removal which states a double tinning process  or dynamic solder wave may be used.  Can any of you describe this process.  How is the gold actually removed?  Or is it just being tinned?  Gold melts at over 1000 C so I am a little confused.

Thanks,

Bob

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