TECHNET Archives

May 2013

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
X-To:
Date:
Thu, 9 May 2013 12:27:31 +0000
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Robert DeQuattro <[log in to unmask]>
Subject:
MIME-Version:
1.0
Message-ID:
Content-Transfer-Encoding:
quoted-printable
Content-Type:
text/plain; charset="us-ascii"
From:
Robert DeQuattro <[log in to unmask]>
Parts/Attachments:
text/plain (13 lines)
Hello Fellow Technetter's,

I have a question on J-Std-001E 4.5.1 Gold removal which states a double tinning process  or dynamic solder wave may be used.  Can any of you describe this process.  How is the gold actually removed?  Or is it just being tinned?  Gold melts at over 1000 C so I am a little confused.

Thanks,

Bob

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2