TECHNET Archives

May 2013

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
TechNet E-Mail Forum <[log in to unmask]>, Ramakrishnan Saravanan <[log in to unmask]>
Date:
Fri, 31 May 2013 14:49:43 +0000
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, "Stadem, Richard D." <[log in to unmask]>
Message-ID:
<[log in to unmask]>
Subject:
Re: PCB RELIABILITY ENGINEERING
From:
"Stadem, Richard D." <[log in to unmask]>
MIME-Version:
1.0
In-Reply-To:
<[log in to unmask]>
Content-Transfer-Encoding:
base64
Content-Type:
text/plain; charset="utf-8"
Parts/Attachments:
text/plain (1 lines) 
Mad Magazine.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ramakrishnan Saravanan
Sent: Friday, May 31, 2013 9:42 AM
To: [log in to unmask]
Subject: [TN] PCB RELIABILITY ENGINEERING

Dear All,

Which book should i study to understand the reliability engineering of PCB. regards,


R.Saravanan

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2