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April 2013

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Mon, 8 Apr 2013 21:04:25 +0000
Content-Type:
text/plain
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text/plain (277 lines)
Richard,
That is why NASA got outgas spec.  Majority of electronics are hermetically sealed for space grade, (flow dust should stay away... hard to get in to something if there is no turbulence to draw or blow or somehow get into it.  As for the tin whiskers, stop using "cat" - avoid to grow whiskers... (design change may be pricy...).  Sn, Zn should be avoid (at least was avoid in the old days...until old chaps went to cottage).  Sn/Pb with a bit of Cd might do, but politically someone want to be "correct" and live dangerously.  Yap, the big space is like cleanroom, what ever bring in, hard to get out, unless you put sticky mouse pad or some kind of trap (filter, etc).  

Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760


-----Original Message-----
From: Stadem, Richard D. [mailto:[log in to unmask]] 
Sent: Monday, April 08, 2013 4:55 PM
To: TechNet E-Mail Forum; Joyce Koo
Subject: RE: [TN] copper nanosolder--fyi

Sorry, Joyce, but incorrect. Particles float inside a vacuum.
Space application technology has more dust and particulates inside while in space due to lack of gravity. Outgassing is also a contributor.
While it usually clears up over time, the issue of particle counts inside of unmanned vehicles is a big one.
For manned vehicles, the issues go up 1000X.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Monday, April 08, 2013 3:46 PM
To: [log in to unmask]
Subject: Re: [TN] copper nanosolder--fyi

Space application.  Yet, it is a big vacuum.  Purest and most clean controlled environments.  As long as in side, no big problem.  Outside, you might have to worry about atomic oxygen, proton, UV, hot and cold, and of course, many junk can hit you.  etc.  

Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of harvey
Sent: Monday, April 08, 2013 4:27 PM
To: [log in to unmask]
Subject: Re: [TN] copper nanosolder--fyi

Yes, note that lead-free solder may not be used in space because of accelerated tin whiskering. Lockheed Space had an incentive to develop a replacement.

As a veteran of the lost battle against the tin industry, I could not be happier that the war is not lost.

--- On Mon, 4/8/13, Wayne Thayer <[log in to unmask]> wrote:

From: Wayne Thayer <[log in to unmask]>
Subject: Re: [TN] copper nanosolder--fyi
To: [log in to unmask]
Date: Monday, April 8, 2013, 12:04 PM

Lockheed's stuff is focused on solder replacement, not Printed Electronics.
________________________________________
From: TechNet [[log in to unmask]] on behalf of Mike Buetow [[log in to unmask]]
Sent: Monday, April 08, 2013 2:45 PM
To: [log in to unmask]
Subject: Re: [TN] copper nanosolder--fyi

Printed Electronics.


Mike Buetow


PCB CHAT: Come chat April 23 about the top 50 EMS Companies:
www.pcbchat.com




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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
Sent: Monday, April 08, 2013 2:05 PM
To: [log in to unmask]
Subject: Re: [TN] copper nanosolder--fyi

PE?
________________________________________
From: TechNet [[log in to unmask]] on behalf of Joyce Koo [[log in to unmask]]
Sent: Monday, April 08, 2013 11:17 AM
To: [log in to unmask]
Subject: Re: [TN] copper nanosolder--fyi

Double layer conduction?  Might be shielding layer for EMI/EMC.  That would be perfect application for PE.

Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760


-----Original Message-----
From: Mike Fenner [mailto:[log in to unmask]]
Sent: Monday, April 08, 2013 10:09 AM
To: 'TechNet E-Mail Forum'; Joyce Koo
Subject: RE: [TN] copper nanosolder--fyi

Good summary Joyce.
I think its clear that PE, with or without nano will not be replacing high speed digital circuitry for some time yet, its opportunities are elsewhere.
There are plenty of examples already. Having said that it's interesting to look at display technology and the additional printed circuitry applied to conventional metal track PCBs. That's kind of PE by the back door. To me PE is just a subset of 3D printing, added layer manufacturing, call it what you will, in fact is part of it.

Regards

Mike Fenner
Bonding Services & Products
M: +44 [0] 7810 526 317
T: +44 [0] 1865 522 663
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Monday, April 08, 2013 2:47 PM
To: [log in to unmask]
Subject: Re: [TN] copper nanosolder--fyi

Many thanks Harvey.  I would very much interest to know the detail of the presentation.  The nano particles are utilized in printed electronics, in various elements and organic conductive media to improve conductivity and flexibility.  Normally, printed electronics are processed in low temperature with large surface contact area (roll to roll printing).
Therefore, it can be flexible and thin, the resistance short coming of the nano-particles due its large surface/interface characteristics (sometimes, it is hopping rather than normal conduction mechanism) are compensated by large conduction contact surfaces and thin joints.

Sintering/fusing of the nano-particle can be done at lower temperature due to highly active surface energy, however, unless performed under pressure, you might get un-controlled re-crystallization and growth of the grain, resulted preferential growth of certain orientation of grain and leave some voids behind (low angle co-incidence grain boundary, as well as twining, are stable boundary, but not high angle gain boundary)- you might get more conductivity loss in high frequency and resistance increase. Of course, all the oxidation must be taking care of (copper is very readily oxidized, even with OSP coated, with that much surface area (nano particle).  Acid media is more less like a flux can take care some of surface oxidation, but you still need to control the coalescence and growth (not all orientation are grow at same rate...).

The existing solder interconnect is heading towards smaller, more compact
(solid) joints, for example, flip chip, or TSV for high speed, high density interconnect (in line with the high density IC with node of <20 nm).  The solder interconnect joints more in the 3D stack, rather than 2D in printed electronics.  High surface/interface might be good for some application, such as low frequency, low temperature application, I am a bit curious how it can be apply to the high frequency, high I/O, short and dense interconnect at lower voltage, and high device temperature (current processor dissipated 40-100W in some cases).  Looking forward to see the presentation (I would really appreciated if you can share with us).  I haven't been in the field for long time, Looking forward to update my knowledge.  Thanks.  My 2 cents.
Best regards,




Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of harvey
Sent: Saturday, April 06, 2013 9:16 PM
To: [log in to unmask]
Subject: [TN] copper nanosolder--fyi

Biltmore Santa Clara for dinner (or non-dinner)
            June 12, 2013.

Dr. Zinn's bio and abstract are at the end.
            Lockheed's nano-copper solder is an answer to the lead-free solder
            fiasco.
Remember "the non-solution to the non-problem", that
            is, until we get rid of most solder altogether, most solder paste,
            anyhow.





                Speaker:
                Alfred Zinn, Lockheed Martin Space
                  System Company ATC, Senior Scientist

                Abstract:

                  NanoCopper Materials Platform for Electronic
                  Packaging and Printed Electronics with 200 °C Processing
                  Temperature

                  The Advanced Technology Center of the Lockheed Martin
                  Corporation has developed a nanocopper-based material that can
                  be fused to bulk copper around 200 °C taking advantage of the
                  rapidly decreasing fusion temperature with decreasing particle
                  size at the nanoscale. The nanocopper material has the
                  potential to replace tin-based solder to eliminate whisker

                  growth and mechanical reliability concerns encountered with
                  current lead-free solder. Fully optimized, the fused copper is
                  expected to exhibit 10-15x electrical and thermal conductivity
                  improvements over tin-based materials currently in use.
The
                  materials platform is enabled by our scalable Cu nanoparticle
                  fabrication process employing a low cost solution-phase
                  chemical reduction approach. A proprietary mixture of
                  surfactants controls particle size and size distribution as
                  well as stabilizing the particles preventing particle growth
                  and oxidation, which would otherwise degrade its activity.
We
                  have demonstrated assembly of fully functional LED test boards
                  using a paste formulated with nanocopper that exhibits a
                  consistency very similar to standard tin-based solder paste.
                  To date, we have demonstrated 26-pin through-hole connector
                  assembly and a variety of surface mount components. We
                  demonstrated feasibility of drop-in solder replacement using
                  standard stencil and pick & place packaging equipment as
                  well as demonstrated feasibility of using the material for

                  printed electronics applications.


                Dr. Zinn
                  received his Doctor of Science degree in Chemistry in
1990

                  from the Philipps University, Marburg, Germany.
Following
                  completion of his graduate studies, Dr. Zinn spent five years
                  at UCLA as a lecturer and conducting postdoctoral research on
                  low-temperature CVD for interconnect, diffusion, and migration
                  barrier deposition, as well as magnetic nanomaterials design
                  and synthesis. In 2004, he joined Lockheed Martin Space
                  Systems Company Advanced technology Center in Palo Alto, CA
                  developing high-temperature materials systems, nanostructured
                  functional materials (electrical, thermal, thermoelectric),
                  modeling quantum/superlattice structures and devices, high

                  performance energy conversion devices (solar, high & low
                  quality heat conversion). He holds seven patents in materials,
                  structures and processing, two THz technology patents, with
                  ten additional patents pending (multiple international
                  filings) as well as four trade secrets. He has authored or

                  co-authored over 20 archival journal publications, including
                  book chapters in "The Chemistry of Metal CVD" as well as the
                  "Encyclopedia of Inorganic
            Chemistry.

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