This may answer your question (if I understand it correctly).

IPC-A-610E, 7.3.5.6 and 7.3.5.7 address this for supported holes.

7.3.5.6  Supported Holes - Solder Conditions - Solder in Lead Bend "Acceptable - class 1, 2 3  Solder in the lead benddoes not contact the component the component body. There is no defect provided all other mounting and fillet criteria are acceptable."

7.3.5.7 Supported Holes - Solder Conditions - Touching Through-Hole Component Body "Acceptable - Class 1, 2, 3 Solder does not touch the component body or end seal.  Defect - Class 1, 2 3 Solder contacts the component body or end seal."

There is a slightly more complex "exception" per 7.3.5.8 so let me know if this is good or you need some more info. 


Greg Munie

>  -------Original Message-------
>  From: Victor Hernandez <[log in to unmask]>
>  To: [log in to unmask]
>  Subject: [TN] Axial Leaded Components
>  Sent: 08 Apr '13 13:36
>  
>  Fellow TechNetters:
>  
>    Is there any IPC Standards and/or other Industry guidelines that address the solder fillet from coming into contact with the 90 degree radius bend of the lead.   I have an e-cap that the lead was formed at three location and the end radius id engulfed in the solder fillet.   Any chance of material degradation due to solder thermal excursion?   I will send Gregory a sample photo.
>  
>  Victor,
>  
>  
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