Lockheed's stuff is focused on solder replacement, not Printed Electronics.
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From: TechNet [[log in to unmask]] on behalf of Mike Buetow [[log in to unmask]]
Sent: Monday, April 08, 2013 2:45 PM
To: [log in to unmask]
Subject: Re: [TN] copper nanosolder--fyi
Printed Electronics.
Mike Buetow
PCB CHAT: Come chat April 23 about the top 50 EMS Companies:
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
Sent: Monday, April 08, 2013 2:05 PM
To: [log in to unmask]
Subject: Re: [TN] copper nanosolder--fyi
PE?
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From: TechNet [[log in to unmask]] on behalf of Joyce Koo
[[log in to unmask]]
Sent: Monday, April 08, 2013 11:17 AM
To: [log in to unmask]
Subject: Re: [TN] copper nanosolder--fyi
Double layer conduction? Might be shielding layer for EMI/EMC. That
would be perfect application for PE.
Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760
-----Original Message-----
From: Mike Fenner [mailto:[log in to unmask]]
Sent: Monday, April 08, 2013 10:09 AM
To: 'TechNet E-Mail Forum'; Joyce Koo
Subject: RE: [TN] copper nanosolder--fyi
Good summary Joyce.
I think its clear that PE, with or without nano will not be replacing high
speed digital circuitry for some time yet, its opportunities are
elsewhere.
There are plenty of examples already. Having said that it's interesting to
look at display technology and the additional printed circuitry applied to
conventional metal track PCBs. That's kind of PE by the back door. To me
PE is just a subset of 3D printing, added layer manufacturing, call it
what you will, in fact is part of it.
Regards
Mike Fenner
Bonding Services & Products
M: +44 [0] 7810 526 317
T: +44 [0] 1865 522 663
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Monday, April 08, 2013 2:47 PM
To: [log in to unmask]
Subject: Re: [TN] copper nanosolder--fyi
Many thanks Harvey. I would very much interest to know the detail of the
presentation. The nano particles are utilized in printed electronics, in
various elements and organic conductive media to improve conductivity and
flexibility. Normally, printed electronics are processed in low
temperature with large surface contact area (roll to roll printing).
Therefore, it can be flexible and thin, the resistance short coming of the
nano-particles due its large surface/interface characteristics (sometimes,
it is hopping rather than normal conduction mechanism) are compensated by
large conduction contact surfaces and thin joints.
Sintering/fusing of the nano-particle can be done at lower temperature due
to highly active surface energy, however, unless performed under pressure,
you might get un-controlled re-crystallization and growth of the grain,
resulted preferential growth of certain orientation of grain and leave
some voids behind (low angle co-incidence grain boundary, as well as
twining, are stable boundary, but not high angle gain boundary)- you might
get more conductivity loss in high frequency and resistance increase. Of
course, all the oxidation must be taking care of (copper is very readily
oxidized, even with OSP coated, with that much surface area (nano
particle). Acid media is more less like a flux can take care some of
surface oxidation, but you still need to control the coalescence and
growth (not all orientation are grow at same rate...).
The existing solder interconnect is heading towards smaller, more compact
(solid) joints, for example, flip chip, or TSV for high speed, high
density interconnect (in line with the high density IC with node of <20
nm). The solder interconnect joints more in the 3D stack, rather than 2D
in printed electronics. High surface/interface might be good for some
application, such as low frequency, low temperature application, I am a
bit curious how it can be apply to the high frequency, high I/O, short and
dense interconnect at lower voltage, and high device temperature (current
processor dissipated 40-100W in some cases). Looking forward to see the
presentation (I would really appreciated if you can share with us). I
haven't been in the field for long time, Looking forward to update my
knowledge. Thanks. My 2 cents.
Best regards,
Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of harvey
Sent: Saturday, April 06, 2013 9:16 PM
To: [log in to unmask]
Subject: [TN] copper nanosolder--fyi
Biltmore Santa Clara for dinner (or non-dinner)
June 12, 2013.
Dr. Zinn's bio and abstract are at the end.
Lockheed's nano-copper solder is an answer to the lead-free
solder
fiasco.
Remember "the non-solution to the non-problem", that
is, until we get rid of most solder altogether, most solder
paste,
anyhow.
Speaker:
Alfred Zinn, Lockheed Martin Space
System Company ATC, Senior Scientist
Abstract:
NanoCopper Materials Platform for Electronic
Packaging and Printed Electronics with 200 °C Processing
Temperature
The Advanced Technology Center of the Lockheed Martin
Corporation has developed a nanocopper-based material
that can
be fused to bulk copper around 200 °C taking advantage
of the
rapidly decreasing fusion temperature with decreasing
particle
size at the nanoscale. The nanocopper material has the
potential to replace tin-based solder to eliminate
whisker
growth and mechanical reliability concerns encountered
with
current lead-free solder. Fully optimized, the fused
copper is
expected to exhibit 10-15x electrical and thermal
conductivity
improvements over tin-based materials currently in use.
The
materials platform is enabled by our scalable Cu
nanoparticle
fabrication process employing a low cost solution-phase
chemical reduction approach. A proprietary mixture of
surfactants controls particle size and size distribution
as
well as stabilizing the particles preventing particle
growth
and oxidation, which would otherwise degrade its
activity.
We
have demonstrated assembly of fully functional LED test
boards
using a paste formulated with nanocopper that exhibits a
consistency very similar to standard tin-based solder
paste.
To date, we have demonstrated 26-pin through-hole
connector
assembly and a variety of surface mount components. We
demonstrated feasibility of drop-in solder replacement
using
standard stencil and pick & place packaging equipment as
well as demonstrated feasibility of using the material
for
printed electronics applications.
Dr. Zinn
received his Doctor of Science degree in Chemistry in
1990
from the Philipps University, Marburg, Germany.
Following
completion of his graduate studies, Dr. Zinn spent five
years
at UCLA as a lecturer and conducting postdoctoral
research on
low-temperature CVD for interconnect, diffusion, and
migration
barrier deposition, as well as magnetic nanomaterials
design
and synthesis. In 2004, he joined Lockheed Martin Space
Systems Company Advanced technology Center in Palo Alto,
CA
developing high-temperature materials systems,
nanostructured
functional materials (electrical, thermal,
thermoelectric),
modeling quantum/superlattice structures and devices,
high
performance energy conversion devices (solar, high & low
quality heat conversion). He holds seven patents in
materials,
structures and processing, two THz technology patents,
with
ten additional patents pending (multiple international
filings) as well as four trade secrets. He has authored
or
co-authored over 20 archival journal publications,
including
book chapters in "The Chemistry of Metal CVD" as well as
the
"Encyclopedia of Inorganic
Chemistry.
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