Fellow TechNetters:

  Is there any IPC Standards and/or other Industry guidelines that address the solder fillet from coming into contact with the 90 degree radius bend of the lead.   I have an e-cap that the lead was formed at three location and the end radius id engulfed in the solder fillet.   Any chance of material degradation due to solder thermal excursion?   I will send Gregory a sample photo.

Victor,


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________