Hi Victor - just a word of clarification. The IPC-7095 specification is 
not a requirements document. A requirement for having a BGA Keep Out Zone 
would be in the IPC JSTD 001 if it existed and I don't believe there is 
keep out zone criteria in the JSTD-001 specification because of the design 
specific nature of such a zone. The IPC-7095 document contains a wealth of 
information that you can use to develop a keep out zone requirement but 
the specification itself does not contain acceptability criteria. For 
example, the IPC-7095 specification contains a ton of information on BGA 
voiding but the JSTD-001 contains the acceptability criteria for BGA 
voids.

Dave Hillman
Rockwell Collins
[log in to unmask]



From:   Victor Hernandez <[log in to unmask]>
To:     <[log in to unmask]>
Date:   04/03/2013 06:29 AM
Subject:        [TN] IPC-7095, BGA Keep Out Zone, IPC Standard
Sent by:        TechNet <[log in to unmask]>



Fellow TechNetters:

  According to the above stated IPC Standard, section 6.1.1 Pick and Place 
Requirements No special placement and CLEARANCE requirement are needed for 
the component pick and place operation.""   However, if it does require 
corner edge glue for reliability purposes then the edge glue will 
encounter some issue/concerns/obstacles.   Ceramic components will be 
saturated will glue and/or create a conflict with glue height for heat 
sink placement.

   I did send Steve some photos for viewing.

Victor,

From: Hernandez, Victor G
Sent: Tuesday, April 02, 2013 1:23 PM
To: TechNet E-Mail Forum ([log in to unmask]<mailto:[log in to unmask]>)
Cc: Hernandez, Victor G
Subject: BGA Keep Out Zone, IPC Standard

Fellow TechNetters:

   Where within the IPC Standards can I find the above stated guidelines 
for components placement on the periphery of a BGA device.?

Victor,

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________




______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________