Fellow TechNetters:

  According to the above stated IPC Standard, section 6.1.1 Pick and Place Requirements No special placement and CLEARANCE requirement are needed for the component pick and place operation.""   However, if it does require corner edge glue for reliability purposes then the edge glue will encounter some issue/concerns/obstacles.   Ceramic components will be saturated will glue and/or create a conflict with glue height for heat sink placement.

   I did send Steve some photos for viewing.

Victor,

From: Hernandez, Victor G
Sent: Tuesday, April 02, 2013 1:23 PM
To: TechNet E-Mail Forum ([log in to unmask]<mailto:[log in to unmask]>)
Cc: Hernandez, Victor G
Subject: BGA Keep Out Zone, IPC Standard

Fellow TechNetters:

   Where within the IPC Standards can I find the above stated guidelines for components placement on the periphery of a BGA device.?

Victor,

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