Bev
...a question for Dr. Zinn of Lockheed Space...
(I'll forward his answer to TN)

Harvey,
What about rework?
Bev

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of harvey
Sent: Saturday, April 06, 2013 9:16 PM
To: [log in to unmask]
Subject: [TN] copper nanosolder--fyi

Biltmore Santa Clara for dinner (or non-dinner) 
            June 12, 2013.

Dr. Zinn's bio and abstract are at the end. 
            Lockheed's nano-copper solder is an answer to the lead-free
solder 
            fiasco.
Remember "the non-solution to the non-problem",
that 
            is, until we get rid of most solder altogether, most solder
paste, 
            anyhow.


            
              
              
                Speaker:
                Alfred Zinn, Lockheed Martin Space 
                  System Company ATC, Senior Scientist
              
                Abstract:
                
                  NanoCopper Materials Platform for Electronic 
                  Packaging and Printed Electronics with 200 °C Processing 
                  Temperature

                  The Advanced Technology Center of the Lockheed Martin 
                  Corporation has developed a nanocopper-based material that
can 
                  be fused to bulk copper around 200 °C taking advantage of
the 
                  rapidly decreasing fusion temperature with decreasing
particle 
                  size at the nanoscale. The nanocopper material has the 
                  potential to replace tin-based solder to eliminate whisker

                  growth and mechanical reliability concerns encountered
with 
                  current lead-free solder. Fully optimized, the fused
copper is 
                  expected to exhibit 10-15x electrical and thermal
conductivity 
                  improvements over tin-based materials currently in use.
The 
                  materials platform is enabled by our scalable Cu
nanoparticle 
                  fabrication process employing a low cost solution-phase 
                  chemical reduction approach. A proprietary mixture of 
                  surfactants controls particle size and size distribution
as 
                  well as stabilizing the particles preventing particle
growth 
                  and oxidation, which would otherwise degrade its activity.
We 
                  have demonstrated assembly of fully functional LED test
boards 
                  using a paste formulated with nanocopper that exhibits a 
                  consistency very similar to standard tin-based solder
paste. 
                  To date, we have demonstrated 26-pin through-hole
connector 
                  assembly and a variety of surface mount components. We 
                  demonstrated feasibility of drop-in solder replacement
using 
                  standard stencil and pick & place packaging equipment as 
                  well as demonstrated feasibility of using the material for

                  printed electronics applications.
              
                 
                Dr. Zinn 
                  received his Doctor of Science degree in Chemistry in 1990

                  from the Philipps University, Marburg, Germany. Following 
                  completion of his graduate studies, Dr. Zinn spent five
years 
                  at UCLA as a lecturer and conducting postdoctoral research
on 
                  low-temperature CVD for interconnect, diffusion, and
migration 
                  barrier deposition, as well as magnetic nanomaterials
design 
                  and synthesis. In 2004, he joined Lockheed Martin Space 
                  Systems Company Advanced technology Center in Palo Alto,
CA 
                  developing high-temperature materials systems,
nanostructured 
                  functional materials (electrical, thermal,
thermoelectric), 
                  modeling quantum/superlattice structures and devices, high

                  performance energy conversion devices (solar, high & low 
                  quality heat conversion). He holds seven patents in
materials, 
                  structures and processing, two THz technology patents,
with 
                  ten additional patents pending (multiple international 
                  filings) as well as four trade secrets. He has authored or

                  co-authored over 20 archival journal publications,
including 
                  book chapters in "The Chemistry of Metal CVD" as well as
the 
                  "Encyclopedia of Inorganic 
            Chemistry.

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