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April 2013

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From:
"Smith, Rick" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Smith, Rick
Date:
Thu, 4 Apr 2013 19:41:54 +0000
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I think your main driver will be if you ever need to rework the BGA without desoldering all of the adjacent components. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Wednesday, April 03, 2013 8:23 AM
To: [log in to unmask]
Subject: Re: [TN] IPC-7095, BGA Keep Out Zone, IPC Standard

Hi Victor - just a word of clarification. The IPC-7095 specification is not a requirements document. A requirement for having a BGA Keep Out Zone would be in the IPC JSTD 001 if it existed and I don't believe there is keep out zone criteria in the JSTD-001 specification because of the design specific nature of such a zone. The IPC-7095 document contains a wealth of information that you can use to develop a keep out zone requirement but the specification itself does not contain acceptability criteria. For example, the IPC-7095 specification contains a ton of information on BGA voiding but the JSTD-001 contains the acceptability criteria for BGA voids.

Dave Hillman
Rockwell Collins
[log in to unmask]



From:   Victor Hernandez <[log in to unmask]>
To:     <[log in to unmask]>
Date:   04/03/2013 06:29 AM
Subject:        [TN] IPC-7095, BGA Keep Out Zone, IPC Standard
Sent by:        TechNet <[log in to unmask]>



Fellow TechNetters:

  According to the above stated IPC Standard, section 6.1.1 Pick and Place Requirements No special placement and CLEARANCE requirement are needed for 
the component pick and place operation.""   However, if it does require 
corner edge glue for reliability purposes then the edge glue will 
encounter some issue/concerns/obstacles.   Ceramic components will be 
saturated will glue and/or create a conflict with glue height for heat sink placement.

   I did send Steve some photos for viewing.

Victor,

From: Hernandez, Victor G
Sent: Tuesday, April 02, 2013 1:23 PM
To: TechNet E-Mail Forum ([log in to unmask]<mailto:[log in to unmask]>)
Cc: Hernandez, Victor G
Subject: BGA Keep Out Zone, IPC Standard

Fellow TechNetters:

   Where within the IPC Standards can I find the above stated guidelines for components placement on the periphery of a BGA device.?

Victor,

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