I vote for Wayne's suggestion. This is exactly what happed on a job once. The temperature profile had temps of 223C under a BGA. 

Bob K.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
Sent: Tuesday, April 30, 2013 9:59 AM
To: [log in to unmask]
Subject: Re: [TN] Creating Head In Pillow Defects

Get a nice SnPb profile set up with a peak at <215C.  Try to solder down a SAC305 BGA without adjusting the profile.  Given the proper dwell times, you should get something that looks like the ball's been wet but there's no metal mixing--you'll see the horizontal line between the alloys.  The joint will be nice and shiny.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall
Sent: Tuesday, April 30, 2013 9:45 AM
To: [log in to unmask]
Subject: [TN] Creating Head In Pillow Defects

Folks,

Can anyone out there tell me how I can intentionally create a head in pillow defect?  I want to see if our X-ray machines are capable of detecting this condition, and if so, how repeatable they are.

I'm sure there are several ways to do this, but I'm looking for the most simple.

Thanks for your help!

Leland

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