Bev,
To add to your commentary, there were coatings that the DoD used for chip
and wire products that worked well for this purpose, but it definitely
required "a need to know", and special clearances, security, facilities, and
certifications, etc.
I know that it graduated to successive generations, but have not been privy
to this in a while now.
For packaged devices - if is also my conclusion that where there is a will,
there is a way. I would first start using X-ray analysis [and/or acoustic
microscopy], followed by mechanical removal of some packaging material,
followed by Decap, or Uresolv Plus to remove the remainder - leaving the die
metallization, wires and lead frame intact.
BTW - Decap or Uresolv Plus will remove the Hysol FP families of glob tops
and dams.
Steve Creswick
Sr Associate - Balanced Enterprise Solutions
http://www.linkedin.com/in/stevencreswick
616 834 1883
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Friday, April 26, 2013 7:37 PM
To: [log in to unmask]
Subject: Re: [TN] tamper proofing electronic assembly
I agree with Dave - from personal experience of having to do it for the
security types in a company of my employment.
The ONLY way I know of to really make it tamper proof is to build it in a
metal box such that if it is opened the circuits inside are fried. That is
what Nortel (now deceased) did for desk phones it built for the UK military.
Bev
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Thursday, April 25, 2013 9:38 AM
To: [log in to unmask]
Subject: Re: [TN] tamper proofing electronic assembly
Hi Eric - have you investigated the use of an epoxy based non-reworkable
underfill material? It has been my experience that trying to remove this
family of materials results in ginormous damage. But - you will need to test
to make sure you don't cause solder joint issues for the LQFP component with
its use. Also note that there is no such thing as a "make it impossible to
remove without damaging it" as given enough time and techniques, any
material can be removed carefully enough to not cause damage as reverse
engineering is a science, not an art.
Dave Hillman
Rockwell Collins
[log in to unmask]
From: Eric Laroche <[log in to unmask]>
To: <[log in to unmask]>
Date: 04/25/2013 07:48 AM
Subject: [TN] tamper proofing electronic assembly
Sent by: TechNet <[log in to unmask]>
Good morning,
One of our customer has requested, for security purposes, that we assemble
their board in such a way to make the removal of the microprocessor
impossible without damaging it. The component is a 64 pin LQFP. The design
is already completed and this requirement came afterwards.
Our approach so far has been to add a material over the part and on the
leads prior to conformal coating. All the materials we have used to this
point have been peeled away when heating the component.
Is this something that some of you have been requested before? How have you
managed to do this?
thanks for your feedback,
Eric
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