Todd,

Generally you are looking at a 30 degree chamfer (both sides). Your spacing will be dictated mainly by the connector. Something that may also need to be considered is how the board will power up upon insertion. In other words you may want your ground pin fingers extended all the way to the board edge and your voltages set back a bit so the board  powers up in a sequence for a "soft-start".

Rick

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of MacFadden, Todd
Sent: Thursday, April 25, 2013 12:35 PM
To: [log in to unmask]
Subject: [TN] Gold Fingers for Edge Connectors - Design Criteria Needed

Hi everyone,

We have a new application that will require thousands of insertions on edge connectors such as you might find on mother board interconnects. This is new to us so we don't have experience or design rules yet.

Are there industry guidelines/requirements for: (1)  plating thickness and performance of hard nickel and hard gold for these types of edge finger connectors; (2) edge chamfer design; (3) finger spacing, etc.

I have seen several good supplier-specific design guidelines for edge fingers, but no industry standards yet. I know only of MIL-G-45204 for hard gold plating; is that useful in this application?

Thanks in advance for any insight.
Todd








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