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April 2013

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Fri, 26 Apr 2013 09:37:14 +0300
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Depending on the application, we used from 2 µm Ni + 1 µm Au to 5 µm Ni 
+ 3 um Au. Note also the porosity of the Au and the climatic conditions 
of use also had to be considered to ensure minimal electrochemical 
corrosion.

Brian

On 25.04.2013 19:34, MacFadden, Todd wrote:
> Hi everyone,
>
> We have a new application that will require thousands of insertions on edge connectors such as you might find on mother board interconnects. This is new to us so we don't have experience or design rules yet.
>
> Are there industry guidelines/requirements for: (1)  plating thickness and performance of hard nickel and hard gold for these types of edge finger connectors; (2) edge chamfer design; (3) finger spacing, etc.
>
> I have seen several good supplier-specific design guidelines for edge fingers, but no industry standards yet. I know only of MIL-G-45204 for hard gold plating; is that useful in this application?
>
> Thanks in advance for any insight.
> Todd
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