Good morning,

One of our customer has requested, for security purposes, that we 
assemble their board in such a way to make the removal of the 
microprocessor impossible without damaging it.  The component is a 64 
pin LQFP.  The design is already completed and this requirement came 
afterwards.

Our approach so far has been to add a material over the part and on the 
leads prior to conformal coating.  All the materials we have used to 
this point have been peeled away when heating the component.

Is this something that some of you have been requested before?  How have 
you managed to do this?

thanks for your feedback,

Eric



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