Victor,

Are you talking about a rigid Flex? If so, we run Thermal stress and solder float all the time on the ones we build.

Mike Lehmicke
Molex Copper Flex Products
22 Empire Drive
St. Paul, MN 55103
651-846-7728
[log in to unmask]



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Tuesday, April 23, 2013 1:43 PM
To: [log in to unmask]
Subject: [TN] Rigid Flex Rigid hybrid FR4 PWB

Fellow TechNetters:

   Is it t appropriate to Thermal Stress, Solder Float, a hybrid FR4 Printed Wire Board?   Is this construction an acceptable practice with IPC Standards?   Is there a document that describes this Test method?   Anyone willing to share their experience.

Victor,

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________




CONFIDENTIALITY NOTICE: This message (including any attachments) may contain Molex confidential information, protected by law. If this message is confidential, forwarding it to individuals, other than those with a need to know, without the permission of the sender, is prohibited.

This message is also intended for a specific individual. If you are not the intended recipient, you should delete this message and are hereby notified that any disclosure, copying, or distribution of this message or taking of any action based upon it, is strictly prohibited.

English | Chinese | Japanese
www.molex.com/confidentiality.html

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________