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April 2013

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Tue, 23 Apr 2013 11:40:31 -0600
Content-Type:
text/plain
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text/plain (110 lines)
Hi Rueven,

 

The photo is of the QFN, not the board. The QFN is matte tin finished...

 

Steve

 

From: Reuven Rokah [mailto:[log in to unmask]] 
Sent: Tuesday, April 23, 2013 11:37 AM
To: TechNet E-Mail Forum; Steve Gregory
Subject: Re: [TN] QFN Pad Corrosion?

 

PCBs finish are ENIG?

May be black pads?

Reuven

On Tue, Apr 23, 2013 at 8:12 PM, Steve Gregory <[log in to unmask]>
wrote:

Hi All,



I have another question about the QFN16 that I was talking about last
week. I was sent a photo of the bottom of one of the devices after it
had been removed from a failed board. It is here:



http://stevezeva.homestead.com/QFN16_Corrosion.jpg



It's pointing out a pad that seemed to have a lot of corrosion on it and
I was told that solder would not wet to it. I was asked what might cause
this?



My first thoughts are that the appearance might have been caused by the
rework when it was removed, and that a un-solderable intermetallic has
formed on pad  but I can't say that for sure. The part is finished with
matte tin when it is supplied. When a part is tin finished, they have a
barrier nickel plate beneath the tin right?



I don't have the part in front of me, I only got sent the photo. I was
asked what my thoughts were, so I thought I'd ask my TechNet friends
too... :o)



Thanks,



Steve Gregory


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