Rex
Yes! Check the archive, your points were raised, you will see a lot of back
and forth,
The announcement below describes an idea for a product/process which may or
may not work and come to market as a product. We won't know for some years.
There is a lot of industry effort looking at nano-particle sintering, but
mostly for a high operating temperature, low cost, Pb-free die attach
material. There is a need there. Mostly the effort has gone into silver
based products some of which have been offered. Everything is going to be
more expensive than lead, so here low cost means when compared to Au/Sn
solder which is probably the only proven working alternative for that
application. That leaves a fairly wide open door I would think.
Different game for PCB soldering, IMHO the balance of benefits and costs
here makes it much harder to displace alternate alloy solders and by the
time Cu sintering works in the application being addressed, is possibly
going to be addressing the wrong question anyway. Another story.
Regards
Mike Fenner
Bonding Services & Products
M: +44 [0] 7810 526 317
T: +44 [0] 1865 522 663
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Rex Waygood
Sent: Friday, April 19, 2013 11:35 AM
To: [log in to unmask]
Subject: Re: [TN] copper nanosolder--fyi
Have I missed something?
How do you rework or do field service returns?
Sorry to be so slow, this has been bugging me.
Rex
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of harvey
Sent: 07 April 2013 02:16
To: [log in to unmask]
Subject: [TN] copper nanosolder--fyi
Biltmore Santa Clara for dinner (or non-dinner)
June 12, 2013.
Dr. Zinn's bio and abstract are at the end.
Lockheed's nano-copper solder is an answer to the lead-free
solder
fiasco.
Remember "the non-solution to the non-problem", that
is, until we get rid of most solder altogether, most solder
paste,
anyhow.
Speaker:
Alfred Zinn, Lockheed Martin Space
System Company ATC, Senior Scientist
Abstract:
NanoCopper Materials Platform for Electronic
Packaging and Printed Electronics with 200 °C Processing
Temperature
The Advanced Technology Center of the Lockheed Martin
Corporation has developed a nanocopper-based material that
can
be fused to bulk copper around 200 °C taking advantage of
the
rapidly decreasing fusion temperature with decreasing
particle
size at the nanoscale. The nanocopper material has the
potential to replace tin-based solder to eliminate whisker
growth and mechanical reliability concerns encountered
with
current lead-free solder. Fully optimized, the fused
copper is
expected to exhibit 10-15x electrical and thermal
conductivity
improvements over tin-based materials currently in use.
The
materials platform is enabled by our scalable Cu
nanoparticle
fabrication process employing a low cost solution-phase
chemical reduction approach. A proprietary mixture of
surfactants controls particle size and size distribution
as
well as stabilizing the particles preventing particle
growth
and oxidation, which would otherwise degrade its activity.
We
have demonstrated assembly of fully functional LED test
boards
using a paste formulated with nanocopper that exhibits a
consistency very similar to standard tin-based solder
paste.
To date, we have demonstrated 26-pin through-hole
connector
assembly and a variety of surface mount components. We
demonstrated feasibility of drop-in solder replacement
using
standard stencil and pick & place packaging equipment as
well as demonstrated feasibility of using the material for
printed electronics applications.
Dr. Zinn
received his Doctor of Science degree in Chemistry in 1990
from the Philipps University, Marburg, Germany. Following
completion of his graduate studies, Dr. Zinn spent five
years
at UCLA as a lecturer and conducting postdoctoral research
on
low-temperature CVD for interconnect, diffusion, and
migration
barrier deposition, as well as magnetic nanomaterials
design
and synthesis. In 2004, he joined Lockheed Martin Space
Systems Company Advanced technology Center in Palo Alto,
CA
developing high-temperature materials systems,
nanostructured
functional materials (electrical, thermal,
thermoelectric),
modeling quantum/superlattice structures and devices, high
performance energy conversion devices (solar, high & low
quality heat conversion). He holds seven patents in
materials,
structures and processing, two THz technology patents,
with
ten additional patents pending (multiple international
filings) as well as four trade secrets. He has authored or
co-authored over 20 archival journal publications,
including
book chapters in "The Chemistry of Metal CVD" as well as
the
"Encyclopedia of Inorganic
Chemistry.
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