TECHNET Archives

April 2013

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Kris Roberson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kris Roberson <[log in to unmask]>
Date:
Wed, 17 Apr 2013 22:24:30 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (14 lines)
This is a reminder that the 5-45 Reflow oven Characterization Standard subcommittee is moving forward with the development of a Reflow Oven Characterization standard.

The first webconference of this subcommittee has been scheduled.

If you would like to participate on this subcommittee but have not yet indicated so, please send an email to [log in to unmask] as soon as possible.

Mr. Kris Roberson
IPC- Association Connecting Electronics Industries(r)
Manager, Assembly Technology
[log in to unmask]
Phone: 847-597-2846
Fax: 847-615-5646
www.ipc.org

ATOM RSS1 RSS2