Oxidation...Oxygeg.question for Bob: Remember our little discussion on
'zero' . What I ask now has no practical application. I have had the
thought before when I used ultrahigh vacuum (exp -12)..Now to question: Is
it possible to remove all oxygen molecules in a volum made of xxxxx. I mean
zero molecules, not one single molecule. Or is there a place in Universe
where a Oxygen atom is unthinkable?

Inge


On 10 April 2013 16:54, Robert Kondner <[log in to unmask]> wrote:

> I will agree about oxidation but not faster drying. I mean the vapor
> pressure of water is already  quite low at room temperature. I think drying
> time for a material with absorbed vapor is fixed by diffusion rates and
> distance. And temperature is a bit driver of diffusion rate. Is air
> pressure
> even in the equation?
>
> Bob K.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah
> Sent: Tuesday, April 09, 2013 2:12 PM
> To: [log in to unmask]
> Subject: Re: [TN] Pakeout and PCB Separators
>
> Baking in Vacuum oven = less pads oxidation and faster drying
>
>
> On Tue, Apr 9, 2013 at 9:00 PM, Glidden, Kevin
> <[log in to unmask]>wrote:
>
> > Someone in Technet not long ago posted up an excellent little write up
> > from  Gordon Davy about water vapor and drying.  I've attached it to
> > Phil and Bob.
> >
> > It contends vacuum ovens do nothing to increase drying rate.
> >
> > Drying is a function of temperature and delta between concentration of
> > water in the middle versus at the surface.
> >
> > I presume, like any drying, the greater the surface area exposed the
> > faster the drying.  I would place the PCBs (as much as possible)
> > directly on racks or in card holders (on edge).
> >
> > -----Original Message-----
> > From: Nutting, Phil [mailto:[log in to unmask]]
> > Sent: Tuesday, April 09, 2013 1:01 PM
> > To: [log in to unmask]
> > Subject: Re: [TN] Pakeout and PCB Separators
> >
> > Robert,
> >
> > How about placing them in a vacuum chamber.  That would release all
> > the moisture and definitely if you could add a little heat.  I would
> > envision separating the boards with a mesh and spacer to allow the
> > moisture to fully escape.  Placing a paper towel between layers might
> > not let all the moisture escape.
> >
> > But then this is just my opinion.
> >
> > Phil Nutting
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
> > Sent: Tuesday, April 09, 2013 12:54 PM
> > To: [log in to unmask]
> > Subject: [TN] Pakeout and PCB Separators
> >
> > Hi,
> >
> >
> >
> > Does anyone know if separators of some type between PCBs can reduce
> > bake out time?
> >
> >
> >
> > If I have a stack of PCBs, and I place something like paper towels
> > between PCBs, can the bake out time be reduced? I would imagine the
> > diffusion rates of moisture in the paper towel material would be much
> > higher than in solid PCB laminate. But, that is just a guess. Could be
> perfect hog wash.
> >
> >
> >
> > My problem is not with PCBs but with 30 mil sheets of plastic that
> > feed a thermoforming process.  I am using PETG but I still see small
> > bubbles in the material after forming. I tried a short bake out, and
> > it helps, but I cannot heat very high as the 30 mil plastic sheets
> > will easily deform. I need to lay them flat, heat gently, and still
> > try to removed moisture. I was wondering what the best way to separate
> > sheets and allow drying might be.
> >
> >
> >
> > Any Ideas?
> >
> >
> >
> > Thanks,
> >
> > Bob K.
> >
> >
> >
> >
> >
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>
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