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April 2013

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From:
Robert Kondner <[log in to unmask]>
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Date:
Tue, 9 Apr 2013 12:53:31 -0400
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Hi,

 

Does anyone know if separators of some type between PCBs can reduce bake out
time?

 

If I have a stack of PCBs, and I place something like paper towels between
PCBs, can the bake out time be reduced? I would imagine the diffusion rates
of moisture in the paper towel material would be much higher than in solid
PCB laminate. But, that is just a guess. Could be perfect hog wash.

 

My problem is not with PCBs but with 30 mil sheets of plastic that feed a
thermoforming process.  I am using PETG but I still see small bubbles in the
material after forming. I tried a short bake out, and it helps, but I cannot
heat very high as the 30 mil plastic sheets will easily deform. I need to
lay them flat, heat gently, and still try to removed moisture. I was
wondering what the best way to separate sheets and allow drying might be.

 

Any Ideas?

 

Thanks,

Bob K.

 



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