Fellow TechNetters:
Is there any IPC Standards and/or other Industry guidelines that address the solder fillet from coming into contact with the 90 degree radius bend of the lead. I have an e-cap that the lead was formed at three location and the end radius id engulfed in the solder fillet. Any chance of material degradation due to solder thermal excursion? I will send Gregory a sample photo.
Victor,
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