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Date: | Mon, 8 Apr 2013 14:39:25 -0500 |
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This may answer your question (if I understand it correctly).
IPC-A-610E, 7.3.5.6 and 7.3.5.7 address this for supported holes.
7.3.5.6 Supported Holes - Solder Conditions - Solder in Lead Bend "Acceptable - class 1, 2 3 Solder in the lead benddoes not contact the component the component body. There is no defect provided all other mounting and fillet criteria are acceptable."
7.3.5.7 Supported Holes - Solder Conditions - Touching Through-Hole Component Body "Acceptable - Class 1, 2, 3 Solder does not touch the component body or end seal. Defect - Class 1, 2 3 Solder contacts the component body or end seal."
There is a slightly more complex "exception" per 7.3.5.8 so let me know if this is good or you need some more info.
Greg Munie
> -------Original Message-------
> From: Victor Hernandez <[log in to unmask]>
> To: [log in to unmask]
> Subject: [TN] Axial Leaded Components
> Sent: 08 Apr '13 13:36
>
> Fellow TechNetters:
>
> Is there any IPC Standards and/or other Industry guidelines that address the solder fillet from coming into contact with the 90 degree radius bend of the lead. I have an e-cap that the lead was formed at three location and the end radius id engulfed in the solder fillet. Any chance of material degradation due to solder thermal excursion? I will send Gregory a sample photo.
>
> Victor,
>
>
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