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April 2013

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Tue, 23 Apr 2013 13:48:48 -0500
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TechNet E-Mail Forum <[log in to unmask]>, "Lehmicke, Michael" <[log in to unmask]>
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"Lehmicke, Michael" <[log in to unmask]>
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Victor,

Are you talking about a rigid Flex? If so, we run Thermal stress and solder float all the time on the ones we build.

Mike Lehmicke
Molex Copper Flex Products
22 Empire Drive
St. Paul, MN 55103
651-846-7728
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Tuesday, April 23, 2013 1:43 PM
To: [log in to unmask]
Subject: [TN] Rigid Flex Rigid hybrid FR4 PWB

Fellow TechNetters:

   Is it t appropriate to Thermal Stress, Solder Float, a hybrid FR4 Printed Wire Board?   Is this construction an acceptable practice with IPC Standards?   Is there a document that describes this Test method?   Anyone willing to share their experience.

Victor,

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