Guy,
Others likely have already touched on this but the Indalloy #2 has a 154°C
liquidus which meets your temp limitations. 80/20 Au/Sn is a 280°C eutectic
which will not meet your temp limitations.
I suspect that 80/20 will be just as expensive as the #2.
Don't know what you substrate/board is, but it will likely not take kindly
to the temps required of 80/20 either.
I view a conductive adhesive as being THE last thing I would do. Instead or
H20E, I would definitely steer you to Ablebond 84-1 [anything in the
84-1LMI, LMINB1, etc series]. Much better thermal characteristics! But
getting any adhesive to adhere to gold is problematic! ANY amount of
substrate/board flex, and the die will pop right off.
Generic silver glasses have too high a cure temp as well.
You could thermosonically flip chip bond this low I/O device to the board if
you could bump either the diode or the board. Simply requires one or two
gold ball bonds [to form the bumps] on each diode [or substrate/board pad].
The Au/Au bond will form nicely at 150°C + ultrasonics and about 35-50 gms
of force per 'bump'. Alas, you require a bondable board and a $250K
bonder... Au/Au thermocompression could work to, but temps will be way too
high. Additionally, the face of the diode will standoff the substrate/board
by 25-50 µm, depending on wire size used, and actual bumping process.
I don't like working with high Indiums either, but don't see an immediate
alternative.
Steve Creswick
Sr Associate - Balanced Enterprise Solutions
http://www.linkedin.com/in/stevencreswick
616 834 1883
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Friday, March 29, 2013 9:28 AM
To: [log in to unmask]
Subject: [TN] solder which does ot scavenge gold
Background info:
We were asked to populate and assembly with a Ma-Com part, MA46H120, a GaAs
Constant Gamma Flip-Chip Varactor Diode. The data sheet says:
Mounting Techniques - These chips were designed to be inserted onto hard or
soft substrates with the junction side down. They can be mounted with
conductive epoxy or with a low temperature solder preform. The die can also
be assembled with the junction side up, and wire or ribbon bonds made to the
pads.
Solder Die Attachment - Solder which does not scavenge gold, such as
Indalloy #2 (80In-15Pb-5Ag) is recommended. Sn-Pb based solders are not
recommended due to solder Embrittlement. Do not expose die to a temperature
greater than 235C, or greater than 200C for longer than 10 seconds.
The Indalloy #2 cost $2,222.00 for 100gm or type five solder paste.
We now have another customer asking for us to solder to thick gold. They
don't have a low temp requirement and asked for SnAu solder (Indalloy #182)
80Au-20Sn. . . I shudder to think what that will cost, and I don't think the
part, an inductor, will survive the 300C reflow.
Question:
Does SAC 305 "scavenge gold"? Would it form a brittle solder connection on a
thick soft gold pad?
Guy
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