Further more, SIMS, TOFSIMS; Auger are often much more expensive than SEM
and FTIR.

 Another comment I have is the use of the word 'corrosion', which seems to
be applied on everything that is deviating from the normal. Does IPC have a
common definition of 'corrosion' ?

Inge

On 4 March 2013 02:26, Vladimir Igoshev <[log in to unmask]> wrote:

> Hi Terry,
>
> With all due respect I have to disagree. I've been doing that kind of
> analysis since last Millennium :-) and have to say that using a higher
> resolution surface analysis technique (WDS and/or SIMS, Auger) in the vast
> majority (or should I say pretty much in all of them)  of cases did not
> help more than EDS.
> Regards,
>
> Vladimir
>
> SENTEC Testing Laboratory Inc.
> 11 Canadian Road, Unit 7.
> Scarborough, ON M1R 5G1
> Tel: (647) 495-8727
> Cell: (416) 899-1882
> www.sentec.ca
>
> -----Original Message-----
> From: Terrym <[log in to unmask]>
> Sender: TechNet <[log in to unmask]>
> Date: Sun, 3 Mar 2013 20:11:14
> To: <[log in to unmask]>
> Reply-To: TechNet E-Mail Forum <[log in to unmask]>, Terrym <
> [log in to unmask]>
> Subject: Re: [TN] corrosion under Solder Mask
>
> We also have been correcting fab processing for years that is the root
> cause. We find that SEM/EDS analysis doesn't give a good quantitative value
> to compare the process to. If you need SEM / support let us know.
>
> Terry Munson's iPhone
>
> On Mar 3, 2013, at 4:31 PM, Inge Hernefjord <[log in to unmask]>
> wrote:
>
> > Vladimir is right, make a SEM investigation to see if it really is
> > corrosion and not something else e.g. contaminated water or crystalized
> > solvent residues etc. And take some high resolution photos at varying
> > magnification.
> >
> > I've been analyzing such things for years  and  I could guide you, as
> well
> > as Vladimir, but you'll certainly find assistance at some uni or
> > independent lab in your area. I am lazy, so instead of using own words, I
> > copied a page from a book, written by a guy in your country. I placed the
> > page in Dropbox/Reports../Analysis../Ramakrishnan. You have admission
> > already.
> >
> > Good Luck
> >
> > Inge
> >
> >
> > On 3 March 2013 00:29, Vladimir Igoshev <[log in to unmask]>
> wrote:
> >
> >> It could be zillions of reasons and unless  proper FA is done you are
> >> NEVER  going to figure out what exactly caused the problem.
> >> ------Original Message------
> >> From: Ramakrishnan Saravanan
> >> Sender: TechNet
> >> To: [log in to unmask]
> >> ReplyTo: TechNet E-Mail Forum
> >> ReplyTo: Ramakrishnan Saravanan
> >> Subject: [TN] corrosion under Solder Mask
> >> Sent: Mar 2, 2013 18:13
> >>
> >> Dear all,
> >>
> >> We have received few MLBs from a contract supplier. The board was
> >> inspected and accepted for wiring. The assembly is for high reliability
> >> applications. We conformal coated, tested,thermal cycled and closed the
> >> package. We opened the package for some rework, we found corrosion under
> >> solder mask on some tracks.
> >>
> >> The corrosion is in the form of  blisters and localized. Center of the
> >> tracks or edge or localized and not covering the entire width of the
> tracks.
> >>
> >> What could be the reason for corrosion under solder mask ?. How to
> >> diagnosed for root cause analysis ? regards,
> >>
> >> R.Saravanan
> >>
> >>
> >> Regards,
> >>
> >> Vladimir
> >>
> >> SENTEC Testing Laboratory Inc.
> >> 11 Canadian Road, Unit 7.
> >> Scarborough, ON M1R 5G1
> >> Tel: (647) 495-8727
> >> Cell: (416) 899-1882
> >> www.sentec.ca
> >>
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