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March 2013

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Subject:
From:
Leland Woodall <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Leland Woodall <[log in to unmask]>
Date:
Thu, 28 Mar 2013 10:46:05 +0000
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I'm interested, Kris.  Please sign me up.

Thanks,

Leland Woodall
________________________________________
From: TechNet [[log in to unmask]] on behalf of Kris Roberson [[log in to unmask]]
Sent: Wednesday, March 27, 2013 4:50 PM
To: [log in to unmask]
Subject: [TN] Call For Participation - Reflow Oven Characterization Standard

This is a call for participation in the 5-45 Reflow Oven Characterization Standard Subcommittee

This committee will be tasked with development and maintenance of a Reflow Oven Characterization Standard.

If you are interested in participation, please send an email to [log in to unmask]<mailto:[log in to unmask]> as soon as possible.

Mr. Kris Roberson
IPC- Association Connecting Electronics Industries(r)
Manager, Assembly Technology
[log in to unmask]<mailto:[log in to unmask]>
Phone: 847-597-2846
Fax: 847-615-5646
www.ipc.org<http://www.ipc.org>
[Description: ipc]

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