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March 2013

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Subject:
From:
Inge Hernefjord <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Inge Hernefjord <[log in to unmask]>
Date:
Mon, 25 Mar 2013 13:45:53 -0700
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Hi, added four articles to 'Wirebonding'
e.g Intermetallic Compound and other bimetallic interface related bond
reactions

Tell me if there is a need for a specific knowhow on wire bonding

Inge


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