We have a product on which the assembly vendor decided to change the power inductor we specified.  The part they used is close to the same size, but even at nominal, the leads overhand the pads on 3 sides under the body.  I raised a concern that these stress points create a risky solder joint.  The engineering group running this project keeps sending me pictures:  "look - it fits on the board and they got solder on the outside of the leads!"  I pointed out that the 3 sides of the joint they can't see are stress points.  Any tips on explaining the risk here?

Pete