TECHNET Archives

March 2013

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Mon, 18 Mar 2013 16:43:19 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (38 lines)
The logic is rational, but the proof is void. Unless something has changed significantly, I would not be too quick reject due to lack of hole fill. If you have some old assemblies that have been functioning flawlessly in the end use environment, I would X-ray a few of those. I would expect the same voiding or incomplete hole fill on those as you are seeing now. They were working, so why reject now. If you fully realize the design relationships and have an individual product profile for that assembly and are assured of the adequacy of the process controls and this lack of fill is a new characteristic then reject away, even though X-ray is not a user friendly production process tool.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Rivera, Raye
Sent: Monday, March 18, 2013 8:54 AM
To: [log in to unmask]
Subject: [TN] x-ray inspection of PTH barrel fill

Greetings all,

I would like to ask the group for an opinion on the following question:

Is it appropriate reject a through-hole solder joint as a defect under IPC-A-610E section 7.3.5.1 (barrel fill < 75%) based on x-ray inspection?

The reason for using x-ray is that the component is in the way and preventing visual inspection of the destination side.

I know that 610 is a visual standard. I see that Section 8.3.12 specifically states that x-ray can be used to identify defects in the special case of BGAs. I find no such statement anywhere in section 7. And the standard is quite specific in calling out exactly what magnification and even lighting should be used for inspection. This leads me to believe that x-ray should NOT be used to identify through-hole defects.

Am I reading too much into this? Your thoughts would be appreciated.

Best regards,
Raye Rivera

QA Manager * Canoga Perkins
20600 Prairie Street * Chatsworth * CA 91311-6008
818-678-3872  * [log in to unmask]


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2