Hi again Inge, I think we are talking about lifted lands or pads right? If so folks should check out IPC A600 . Beware of this slippery slope though. Gerry
 > Date: Thu, 14 Mar 2013 17:01:26 +0100
> From: [log in to unmask]
> Subject: Re: [TN] IPC-6012
> To: [log in to unmask]
> 
> I'm not sure what 'contractive' means as I only have British English
> between my eyes, a weakness I have to live with. Mike may come to swing his
> formidable tongue, or Brian Ellis. However,  partially 'flitted' pads
> sounds to me equal to future catastrophic failures. That you did not find
> flitting in IPC-6012 does not mean that the failure category doesn't exist.
> What is of most importance is what is required according to YOUR process
> documents!  That is something that is hammered into my Cortex Electronica
>  during  many years at Ericsson.
> 
> You mention nothing about your thermal stress conditions, so the gurus may
> have some difficulty with doing a correct judgement.
> 
> Inge
> 
> On 13 March 2013 22:18, Vladimir Igoshev. PhD <[log in to unmask]>wrote:
> 
> > I have a question for boards gurus,
> >
> > We run a set of tests to assess the workmanship of a PWB. The board
> > had vias-in-pad (in essence PTHs overplated with Cu pads) under a BGA.
> >
> > After a thermal stress the pads were partially flitted due to cracked
> > laminated underneath them. To me it's a recipe for disaster  (like pad
> > cratering after assembly).     However, I saw nothing about it in
> > IPC-6012. Did I just miss it?
> >
> > I'd really appreciate any contractive comments.
> >
> > --
> > Best regards,
> >
> > Vladimir Igoshev. PhD                          mailto:
> > [log in to unmask]
> >
> > SENTEC Testing Laboratory Inc.
> > 11 Canadian Road, Unit 7.
> > Scarborough, ON M1R 5G1
> > Tel: (416) 899-1882
> > Fax: (905) 882-8812
> > www.sentec.ca
> >
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