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March 2013

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Subject:
From:
Inge Hernefjord <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Inge Hernefjord <[log in to unmask]>
Date:
Thu, 14 Mar 2013 18:11:25 +0100
Content-Type:
text/plain
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You mean there really is a norm! I have been looking for a std many years.
 Then I can tell the guys at my former company. Excellent.
Inge

On 13 March 2013 13:48, Douglas Pauls <[log in to unmask]> wrote:

> Ioan,
>
> Depends on what material you are talking about.
> You can  start with ASTM D3359.  Most other methods are a derivative of
> this one.
> There are a number of IPC test methods on tape pull testing of materials
> 2.4.1.1 is for marking inks and paint, but has not been updated recently
> 2.4.28 covers solder mask adhesion
> 2.4.29 covers solder mask adhesion on flex
>
>
> Doug Pauls
>
>
>
> From:   Ioan Tempea <[log in to unmask]>
> To:     <[log in to unmask]>
> Date:   03/13/2013 07:35 AM
> Subject:        [TN] Tape test
> Sent by:        TechNet <[log in to unmask]>
>
>
>
> Dear Technos,
>
> Which standard covers the tape test for coatings on electronic assemblies?
>
> Thanks,
>
> Ioan Tempea, ing.
> Ingénieur principal de fabrication / Senior Manufacturing Engineer
> [signature002]<http://www.digico.cc/>
>
> 950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f>
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> Entreprise manufacturière / Gestion du capital humain
>
>
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