There is also the possibility to use a laser repair station, if your
company was large enough to invest in such a machine.
I agee with Richard, there isn't a specification or a paragraph for each
litlle moment.

Inge
On 12 March 2013 08:49, Stadem, Richard D. <[log in to unmask]>wrote:

> I don't think there is such a documented procedure detailed. The steps I
> would use are:
>
> 1. Wick all solder from the pad/lead to be lifted using unfluxed solder
> braid, just add flux approved by the program or process documentation to
> the braid. After all of the solder is removed, some will remain under the
> lead. Do not attempt to lift the lead yet.
> 2. Clean the solder tip and get as much solder off of the tip as possible.
> 3. Grasp the lead at mid-shin using a ceramic or high-temp polymer
> ESD-approved tweezer, and touch the pad with the solder tip. Gently apply
> upward pressure on the lead, and lift it just high enough to separate it
> from the pad (but no higher) when the remaining solder melts between the
> lead and the pad.
> 4. While holding the lead at the shoulder so no stress is applied where it
> enters the component body, use a second tweezers to lift and straighten the
> shin and foot of the lead.
> 5. Clean the area and dry.
> 6. If the pad is to be isolated, epoxy a shim over the pad per IPC
> 7711/7721, but do not get any epoxy on the lifted lead. Cure.
> 7. Flux and solder the jumper to the lifted lead (if required). Follow the
> rest of the steps in IPC 7711/7721.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Mordechai Kirshenbaum
> Sent: Tuesday, March 12, 2013 10:30 AM
> To: [log in to unmask]
> Subject: [TN] IPC procedure for disconnecting one soldered lead of a SMT
> component
>
> T-netter's;
>
> I am looking  for a IPC procedure for  disconnecting  one soldered lead of
> a SMT component .
> (i.e. to lift one lead without damaging the component or the other solder
> joints) IPC 7711/21 have procedures for component removal (for example
>  procedure 3.8 J -Lead Removal), but not a procedure that we need.
>
> Can anyone help?
>
>
> Thanks in advance for your responses.
>
>
> Mordechai Kirshenbaum
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud service.
> For more information please contact helpdesk at x2960 or [log in to unmask]
> ______________________________________________________________________
>


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________