Thank you John,

If I understood what IPC says correctly, then there is a layer of Current (wrap plating), as it makes actual solderable pad. Am I confused?
Regards,

Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (647) 495-8727
Cell: (416) 899-1882
www.sentec.ca

-----Original Message-----
From: John Parsons <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Wed, 13 Mar 2013 16:05:32 
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
        John Parsons
	<[log in to unmask]>
Subject: Re: [TN] IPC-6012

Vladimir,

Take a look at the specification for wrap plating that came out as IPC-6012B
Amendment 1 (Dec 2006).  I don't think I see any signs of the required wrap
plating in those samples.

Regards,

John Parsons


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: March-13-13 3:51 PM
To: [log in to unmask]
Subject: Re: [TN] IPC-6012

Hi Vladimir!

Have your pictures posted now, they are here:

http://stevezeva.homestead.com/Overall_view.jpg

http://stevezeva.homestead.com/Close-up_of_crack_in_laminate_and_lifted_pad.
jpg

Never have seen anything like that before...

Steve

-----Original Message-----
From: Vladimir Igoshev. PhD
Sent: Wednesday, March 13, 2013 6:27 PM
To: Steve Gregory
Subject: Re: [TN] IPC-6012

Thank you Steve. Here they are.



--
Best regards,

Vladimir Igoshev. PhD
mailto:[log in to unmask]

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca 


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