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March 2013

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
Date:
Wed, 13 Mar 2013 22:03:33 +0000
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Yes, that is exactly how it was done; a plated through hole that was filled and they overplated to form a BGA pad?

I obviously have cross-sectional SEM images and can send couple of them to Steve if he doesn't mind.
Regards,

Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (647) 495-8727
Cell: (416) 899-1882
www.sentec.ca

-----Original Message-----
From: Robert Kondner <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Wed, 13 Mar 2013 17:51:14 
To: <[log in to unmask]>
Reply-To: <[log in to unmask]>
Subject: Re: [TN] IPC-6012

Hi,

 First, Got Pictures and/or cross sections? Maybe some info about the size
of via and size of pad would help.

 By chance was this a plated through hole that was filled and they over
plated to form a BGA pad?

Bob K.

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev. PhD
Sent: Wednesday, March 13, 2013 5:18 PM
To: [log in to unmask]
Subject: [TN] IPC-6012

I have a question for boards gurus,

We run a set of tests to assess the workmanship of a PWB. The board had
vias-in-pad (in essence PTHs overplated with Cu pads) under a BGA.

After a thermal stress the pads were partially flitted due to cracked
laminated underneath them. To me it's a recipe for disaster  (like pad
cratering after assembly).     However, I saw nothing about it in
IPC-6012. Did I just miss it?

I'd really appreciate any contractive comments.

--
Best regards,

Vladimir Igoshev. PhD
mailto:[log in to unmask]

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

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