Hi,

 First, Got Pictures and/or cross sections? Maybe some info about the size
of via and size of pad would help.

 By chance was this a plated through hole that was filled and they over
plated to form a BGA pad?

Bob K.

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev. PhD
Sent: Wednesday, March 13, 2013 5:18 PM
To: [log in to unmask]
Subject: [TN] IPC-6012

I have a question for boards gurus,

We run a set of tests to assess the workmanship of a PWB. The board had
vias-in-pad (in essence PTHs overplated with Cu pads) under a BGA.

After a thermal stress the pads were partially flitted due to cracked
laminated underneath them. To me it's a recipe for disaster  (like pad
cratering after assembly).     However, I saw nothing about it in
IPC-6012. Did I just miss it?

I'd really appreciate any contractive comments.

--
Best regards,

Vladimir Igoshev. PhD
mailto:[log in to unmask]

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

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