I have a question for boards gurus,

We run a set of tests to assess the workmanship of a PWB. The board
had vias-in-pad (in essence PTHs overplated with Cu pads) under a BGA.

After a thermal stress the pads were partially flitted due to cracked
laminated underneath them. To me it's a recipe for disaster  (like pad
cratering after assembly).     However, I saw nothing about it in
IPC-6012. Did I just miss it?

I'd really appreciate any contractive comments.

-- 
Best regards,

Vladimir Igoshev. PhD                          mailto:[log in to unmask]

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

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