TECHNET Archives

March 2013

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Tape test
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Wed, 13 Mar 2013 15:28:47 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (78 lines) 
Doug,

Browsed through ASTM D3359, things are rather clear, so I don't understand your "depends" ;-)   TM-650 2.4.1.6 covers the longer ASTM method, so I'll pass it.

The trouble I see coming though is cutting deep enough through coating (without chopping soldermask and traces) at 3 different sites on production boards. How should I go about it? Defective bare PCBs, that are rather scarce?

Thanks,

Ioan Tempea, ing.
Ingénieur principal de fabrication / Senior Manufacturing Engineer
[signature002]<http://www.digico.cc/>

950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f>
T+ 1 (450) 967-7100, EXT244
------------------------------------------------------------------------
  [signature001] <http://www.facebook.com/pages/Digico/277076778479>
------------------------------------------------------------------------
Lauréat Dunamis 2012<http://digico.cc/dunamis-2012/>
Entreprise manufacturière / Gestion du capital humain

De : [log in to unmask] [mailto:[log in to unmask]]
Envoyé : March-13-13 8:49 AM
À : TechNet E-Mail Forum; Ioan Tempea
Objet : Re: [TN] Tape test

Ioan,

Depends on what material you are talking about.
You can  start with ASTM D3359.  Most other methods are a derivative of this one.
There are a number of IPC test methods on tape pull testing of materials
2.4.1.1 is for marking inks and paint, but has not been updated recently
2.4.28 covers solder mask adhesion
2.4.29 covers solder mask adhesion on flex


Doug Pauls



From:        Ioan Tempea <[log in to unmask]<mailto:[log in to unmask]>>
To:        <[log in to unmask]<mailto:[log in to unmask]>>
Date:        03/13/2013 07:35 AM
Subject:        [TN] Tape test
Sent by:        TechNet <[log in to unmask]<mailto:[log in to unmask]>>
________________________________



Dear Technos,

Which standard covers the tape test for coatings on electronic assemblies?

Thanks,

Ioan Tempea, ing.
Ingénieur principal de fabrication / Senior Manufacturing Engineer
[signature002]<http://www.digico.cc/>

950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f>
T+ 1 (450) 967-7100, EXT244
------------------------------------------------------------------------
 [signature001] <http://www.facebook.com/pages/Digico/277076778479>
------------------------------------------------------------------------
Lauréat Dunamis 2012<http://digico.cc/dunamis-2012/>
Entreprise manufacturière / Gestion du capital humain


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]>
______________________________________________________________________


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2