I agree with Denny that this is the type of situation where a little communication with your customer could go a long way in making him a better designer. I suspect he doesn't even know about the minimum hole wall plating spec, but is merely trying to tell you that you should start with half-ounce copper (not mils, by the way). 
and
In this case the word FINISH is not related to the board finish, but to the finished copper thickness. 
but...
I would bet a lunch that the designer doesn't really care about the finished copper thickness on the surface layers, he is just telling you that he designed it for half-ounce starting copper. 

Jack

On Thu, 28 Feb 2013 13:15:31 -0500, Dennis Fritz <[log in to unmask]> wrote:

>Can you ask your customer more about "WHY" he wants this specification?  To me, more is left unsaid, than is specified.  If he really wants 1.0 mil of conductor thickness on the surface - could it be for solder mask coverage, for flatness for bottom-terminated-components, BGA pads, etc?   
>
>I am willing to bet that the customer wants 1.0 mils of plating in any via holes or component mounting holes to prevent cracks and/or blow holes there.  BUT, he may not know that specifying plating of 0.5mils on the surface makes it almost impossible to plate 1.0 mil in the holes.  This spec can be met with "tricks" like heavy microetch to thin the starting foil, use of the newer "via fill" acid copper electroplate, or mechanically sanding the panel surface at some point to get 1.0 mil thickness. 
>
>However, I am willing to bet this is just poor communication of actual desires for the finished product. 
>
>Denny Fritz
>
>> Date: Thu, 28 Feb 2013 11:44:58 -0500
> From: [log in to unmask]
> Subject: [TN] Notes in PCB Fabrication
> To: [log in to unmask]
> 
> Hello All!
> 
> I'm having a curious note in a fabrication drawing and I would like to 
> know if it makes sense.
> 
> "1.0oz FINISH (0.5oz COPPER + 0.5oz PLATING)"
> 
> And somewhere else in the notes, ENIG is specified...
> 
> Ideas?
> 
> JF