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March 2013

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Subject:
From:
Jason Zhao <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jason Zhao <[log in to unmask]>
Date:
Fri, 8 Mar 2013 09:28:15 -0600
Content-Type:
text/plain
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text/plain (64 lines)
Try ZETA material, it will reduce your overall thickness compared to regular
FR4.

Best Regards,

Jason Zhao
VP of North America Operations
Sunshine Circuits
3400 Silverstone Drive, Suite 139, Plano, TX 75023
US Cell 510-468-4412, China Cell 131-62722392
www.sunshinepcbgroup.com

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
Sent: Thursday, February 14, 2013 9:50 AM
To: [log in to unmask]
Subject: Re: [TN] Buried/blind/stacked via layups

8 layers:  Core + 3 sequential layers on either side Overall thickness
0.020"


-----Original Message-----
From: Dwight Mattix [mailto:[log in to unmask]]
Sent: Thursday, February 14, 2013 10:17 AM
To: TechNet E-Mail Forum; Wayne Thayer; [log in to unmask]
Subject: Re: [TN] Buried/blind/stacked via layups

At 06:44 AM 2/14/2013, Wayne Thayer wrote:
>On high density boards, they are generally built on a "normal" core, 
>then have microvia layers added simultaneously to top and bottom, one 
>layer at a time (also called "sequential layup").
>
>To increase density, microvias can be filled, then outer layer vias can 
>be stacked directly on top.
>
>Is it OK to do the same with the core layer vias?  Fill, overplate, 
>then stack microvias on top of them?

"It depends"

1. on the supplier. Some will no-bid.
2. On Min lines and spaces you expect for those layers. Minimum resolution
will increase due to the increased plating and process complexity.
3. The buried via size and core thickness a fab is capable of will vary. Not
just what they can accomplish in stack but what they can build that will be
reliable in the stacked column of uVia to buried via.

What are particulars of stackup you have in mind?  Layer count, overall
thickness, material, copper thicknesses, via/pad sizes 

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