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Date: | Wed, 13 Mar 2013 17:51:14 -0400 |
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Hi,
First, Got Pictures and/or cross sections? Maybe some info about the size
of via and size of pad would help.
By chance was this a plated through hole that was filled and they over
plated to form a BGA pad?
Bob K.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev. PhD
Sent: Wednesday, March 13, 2013 5:18 PM
To: [log in to unmask]
Subject: [TN] IPC-6012
I have a question for boards gurus,
We run a set of tests to assess the workmanship of a PWB. The board had
vias-in-pad (in essence PTHs overplated with Cu pads) under a BGA.
After a thermal stress the pads were partially flitted due to cracked
laminated underneath them. To me it's a recipe for disaster (like pad
cratering after assembly). However, I saw nothing about it in
IPC-6012. Did I just miss it?
I'd really appreciate any contractive comments.
--
Best regards,
Vladimir Igoshev. PhD
mailto:[log in to unmask]
SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
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