TECHNET Archives

March 2013

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
X-To:
Date:
Sat, 2 Mar 2013 17:13:34 -0600
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Ramakrishnan Saravanan <[log in to unmask]>
Subject:
MIME-Version:
1.0
Message-ID:
Content-Type:
text/plain; charset="UTF-8"
Content-Transfer-Encoding:
quoted-printable
From:
Ramakrishnan Saravanan <[log in to unmask]>
Parts/Attachments:
text/plain (10 lines)
Dear all,

We have received few MLBs from a contract supplier. The board was inspected and accepted for wiring. The assembly is for high reliability applications. We conformal coated, tested,thermal cycled and closed the package. We opened the package for some rework, we found corrosion under solder mask on some tracks. 

The corrosion is in the form of  blisters and localized. Center of the tracks or edge or localized and not covering the entire width of the tracks. 

What could be the reason for corrosion under solder mask ?. How to diagnosed for root cause analysis ? regards,

R.Saravanan

ATOM RSS1 RSS2