Sender: |
|
X-To: |
|
Date: |
Thu, 14 Mar 2013 08:08:21 -0800 |
Reply-To: |
|
Subject: |
|
From: |
|
Message-ID: |
|
In-Reply-To: |
|
Content-Type: |
text/plain; charset="US-ASCII" |
MIME-Version: |
1.0 |
Parts/Attachments: |
|
|
Yes we need temperature extremes dwell times ramp rates etc for
interconnects the recommended ramp rate is 10 to 12 degrees C per minute
as measured on the DUT
see JESD22-A104D
John Burke
General Manager/COO
Zollner Electronics Inc
Plant Milpitas
575 Cottonwood Drive
Milpitas, CA 95035
Phone: + 1 408 434 5442
Fax: + 1 408 434 5401
Mobile: + 1 408 628 2433
E-mail: [log in to unmask]
Internet: www.zollner-electronics.com
From: Inge Hernefjord <[log in to unmask]>
To: <[log in to unmask]>
Date: 03/14/2013 09:03 AM
Subject: Re: [TN] IPC-6012
Sent by: TechNet <[log in to unmask]>
I'm not sure what 'contractive' means as I only have British English
between my eyes, a weakness I have to live with. Mike may come to swing
his
formidable tongue, or Brian Ellis. However, partially 'flitted' pads
sounds to me equal to future catastrophic failures. That you did not find
flitting in IPC-6012 does not mean that the failure category doesn't
exist.
What is of most importance is what is required according to YOUR process
documents! That is something that is hammered into my Cortex Electronica
during many years at Ericsson.
You mention nothing about your thermal stress conditions, so the gurus may
have some difficulty with doing a correct judgement.
Inge
On 13 March 2013 22:18, Vladimir Igoshev. PhD
<[log in to unmask]>wrote:
> I have a question for boards gurus,
>
> We run a set of tests to assess the workmanship of a PWB. The board
> had vias-in-pad (in essence PTHs overplated with Cu pads) under a BGA.
>
> After a thermal stress the pads were partially flitted due to cracked
> laminated underneath them. To me it's a recipe for disaster (like pad
> cratering after assembly). However, I saw nothing about it in
> IPC-6012. Did I just miss it?
>
> I'd really appreciate any contractive comments.
>
> --
> Best regards,
>
> Vladimir Igoshev. PhD mailto:
> [log in to unmask]
>
> SENTEC Testing Laboratory Inc.
> 11 Canadian Road, Unit 7.
> Scarborough, ON M1R 5G1
> Tel: (416) 899-1882
> Fax: (905) 882-8812
> www.sentec.ca
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud
service.
> For more information please contact helpdesk at x2960 or
[log in to unmask]
> ______________________________________________________________________
>
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
|
|