 
| Sender: |
|
| X-To: |
|
| Date: |
Wed, 13 Mar 2013 17:18:02 -0400 |
| Reply-To: |
|
| Message-ID: |
|
| Subject: |
|
| From: |
|
| Content-Transfer-Encoding: |
quoted-printable |
| Content-Type: |
text/plain; charset="iso-8859-1" |
| Organization: |
SENTEC Testing laboratory Inc. |
| MIME-Version: |
1.0 |
| Parts/Attachments: |
|
|
I have a question for boards gurus,
We run a set of tests to assess the workmanship of a PWB. The board
had vias-in-pad (in essence PTHs overplated with Cu pads) under a BGA.
After a thermal stress the pads were partially flitted due to cracked
laminated underneath them. To me it's a recipe for disaster (like pad
cratering after assembly). However, I saw nothing about it in
IPC-6012. Did I just miss it?
I'd really appreciate any contractive comments.
--
Best regards,
Vladimir Igoshev. PhD mailto:[log in to unmask]
SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
|
|
