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March 2013

DesignerCouncil@IPC.ORG

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DesignerCouncil <[log in to unmask]>
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Fri, 22 Mar 2013 14:27:52 +0000
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"(Designers Council Forum)" <[log in to unmask]>, Fred Dark <[log in to unmask]>
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Fred Dark <[log in to unmask]>
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Hi Designer council - I have a design where we have a power board that's 8 layers... the technology is surface mount and thru-hole... we are having soldering issues with the thru-hole parts getting the solder to wick up in to the barrel for IPC class 2... the most we have achieved is 30% of the barrel... the stack-up has 5 GND planes that these part connect to as a design requirement from the Ee... the planes are 2oz copper each and the thermals are 15mils that connect the thru-hole pin... component stack-up reference : .065dia pad, .085dia anti-pad and 4 - .015 spokes(45 degree angle), drill .035dia(FHS) component pin dia = .020dia... any suggestions..?


Regard's, Frederick Dark Jr.
Manager Senior PCB Designer
Crestron Electronics, Inc.
22 Link Drive Rockleigh N.J. 07647
P:201.750.7004 ext.11320
F:210.767.5772
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